Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)
By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.
Copper with a standard thickness of 18μ can generate high heat and, in some cases, may even break when a large current flows through it, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper thickness of 400μ. For more details, please contact us or refer to our catalog.
- 企業：ケイツー
- 価格：Other
